Judging from the pace of industrial development

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The rapid development of current high-computing power application scenarios will accelerate the evolution of optical modules from 400g/800g to 1.6t. At the 1.6t rate, the integration and power consumption of traditional pluggable optical modules will become more prominent.

Cpo is expected to replace traditional pluggable optical modules because it heterogeneously integrates the optical transceiver module and the asic chip for control calculation in one package, improving the interconnection density between the two while achieving lower power consumption.

Silicon photonics technology, one of the core technologies of cpo, is the mainstream solution for achieving highly integrated chips . It uses silicon and silicon-based substrate materials as optical media and manufactures corresponding photonic and optoelectronic devices through integrated circuit processes. Based on the inherent characteristics of silicon materials, silicon photonic modules have significant advantages in high integration, high speed and low cost compared to traditional optical modules.

The silicon photonics industry chain is being improved and has gambling data vietnam initially covered various links including technology research institutions, design tool providers, system equipment vendors, foundries, and users.

As silicon photonics technology matures, domestic companies are expected to use it to enter the cpo industry. Leading optical module company zhongji xuchuan is actively promoting 1.6t silicon photonic solutions, and eoptoelectronics' 400g/800g silicon photonic modules have entered the mass production stage. The silicon valley high-power laser launched by yuanjie technology at the beginning of last year has the opportunity to be shipped in small batches.

Giants in the overseas chip industry chain are also actively deploying cpo technology. In march last year, broadcom announced that it had delivered the industry's first 51.2t cpo ethernet switch to its customers, and is trying to further expand cpo technology from switches to computing chips to achieve a larger-scale expansion domain.

Also attracting attention is tsmc's 3d packaging solution. Cpo technology will further increase the demand for advanced packaging processes. Cpo technology based on 3d packaging is currently a hot trend in process research.